Bonding technology includes components and systems for joining by gluing. Systems for adhesive application are used for the storage, processing, mixing, dosing, extrusion and application of liquid to highly viscous media, including the necessary handling. A application-specific system comprises the material supply for one or more components, a control and metering of the material flow as well as for applying the materials dosing heads or dosing and mixing heads for dosing and mixing the components. This includes a control system. In automatic systems, the dosing head, which applies the media, is moved by a handling system or the workpieces are conveyed under the dosing head. Depending on the handling, the material application is punctiform, flat, sprayed, caterpillars or squiggles and can be controlled over time, pressure, mass or volume. During bonding a certain cooling or curing time follows, depending on the process, until the desired final strength is reached. Dosing systems for bonding are basically designed for the application of a specific material, but can often be implemented using standardized components. Stations and systems with manual handling of the dispensing heads or freely programmable automatic handling are applied. Portalmodules, cartesian robots and articulated robots can be flexibly used for different workpiece geometries. Dosing systems enable the production of non-detachable joint connections by gluing. Dosing systems are found in many areas of assembly technology. Important user industries are the automotive supplier and automotive industry, manufacturers of electronics, electrical and household appliances, medical technology, machine and special plant construction and other industries.