The joining parts are fed manually or automatically and fixed in the joining position. The induction loop is positioned so that the joining parts are enclosed. The solder is added to the soldering joint, for example, as a paste. There should be no sensitive electronic components in the vicinity of the soldered joint, which can be damaged by induced currents. A high-frequency alternating current is then applied to the soldering point and an electromagnetic alternating field is generated. This alternating field induces a voltage in the joining parts, which in turn generates an alternating current and causes heating of the current-carrying surface, whereby the previously applied solder paste melts. In operation cooling of the coil is required. In addition, the monitoring of the soldering point temperature is ensured by a non-contact temperature measuring system.