The soldering technology for laser soldering includes components, machines and customer-specific systems and can be used for soldering, brazing or high-temperature soldering. During laser soldering, the energy for heating the joining parts and for melting the solder is introduced by a laser beam focused on the soldering point. Laser soldering is a material joining process, in which the joining partners are joined by solder as an additional material. The soldering process can also take place unde...
The soldering technology for laser soldering includes components, machines and customer-specific systems and can be used for soldering, brazing or high-temperature soldering. During laser soldering, the energy for heating the joining parts and for melting the solder is introduced by a laser beam focused on the soldering point. Laser soldering is a material joining process, in which the joining partners are joined by solder as an additional material. The soldering process can also take place under inert gas or in a vacuum. The laser beam enables the point-to-point transmission of a high energy to the soldering points, which are heated very narrowly in time and space. As a result, almost no thermal load occurs on the components. Laser soldering allows high quality solder joints with high process reliability and is particularly suitable for joining high-sensitivity components as well as for hard-to-reach solder joints. Necessary components are the laser beam source, the beam guidance system, the focusing optics, a movement system for starting the soldering points and the control. Furthermore, fixation and handling for the joining parts and the solder as well as the devices for a protective gas atmosphere or a vacuum chamber may be necessary. Laser soldering enables contactless heat transfer without contamination by soldering tools, exact focusing and high power density, as well as a high quality of the solder joints with high process reliability. It can be used for soft soldering, brazing and high temperature soldering and allows the joining of different material pairs. Solderable materials are metals such as copper, brass, bronze, aluminum and aluminum alloys or, Such as ceramics and glass. Laser soldering is particularly used for joining electrical and electronic assemblies and components. Due to the very low thermal load, the process is particularly suitable for high-sensitivity components. In addition, it is usually used in mass production for reasons of cost. Typical applications are the soldering of assemblies with only a few soldering points, such as the assembly of SMD boards with plugs, wired assemblies or special components, as well as the joining of low voltage cables. Important user industries are, such as electronics manufacturers and the automotive supply industry.
Supplier: Joining systems for Laser soldering
ATN Automatisierungstechnik Niemeier GmbH, 12487 Berlin, Deutschland