Knowledge in Factory automation

Joining technology for Bonding

Source: Hilger u. Kern GmbH
Bonding technology includes components and systems for joining by gluing. Systems for adhesive application are used for the storage, processing, mixing, dosing, extrusion and application of liquid to highly viscous media, including the necessary handling. A application-specific system comprises the material supply for one or more components, a control and metering of the material flow as well as for applying the materials dosing heads or dosing and mixing heads for dosing and mixing the components. This includes a control system. In automatic systems, the dosing head, which applies the media, is moved by a handling system or the workpieces are conveyed under the dosing head. Depending on the handling, the material application is punctiform, flat, sprayed, caterpillars or squiggles and can be controlled over time, pressure, mass or volume. During bonding a certain cooling or curing time ...

Products preview: Joining systems for Bonding


AAT Aston GmbH
Atlas Copco IAS GmbH
bdtronic GmbH
D+P Dosier- und Prüftechnik GmbH
Dürr Aktiengesellschaft
Ekobia Systems UG
Ingenieurbüro Ing. grad. Uwe Tank GmbH
LAK Lack-, Abdicht-, und Kleberauftragssysteme GmbH
MDS Maschinen- und Werkzeugbau GmbH
Nordson Corporation
RAMPF Production Systems GmbH & Co. KG
Reinhardt Technik GmbH
Sonderhoff Holding GmbH
Unitechnologies SA